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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only Features * Meet ROHS, Green Product. * Side looking special for LCD backlight. * Package in 8mm tape on 7" diameter reels. * Compatible with automatic placement equipment. * Compatible with infrared reflow solder process. * EIA STD package. * I.C. compatible. Package Dimensions
Part no. LTST-S320ZBKT-5A
Notes: 1. All dimensions are in millimeters (inches).
Lens Water Clear
Source Color InGaN Blue
2. Tolerance is 0.10 mm (.004") unless otherwise noted.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only Absolute Maximum Ratings At Ta=25
Parameter
Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range Infrared Soldering Condition
LTST-S320ZBKT-5A 76 100 20 5 -20C to + 80C -30C to + 100C 260C For 10 Seconds
Unit
mW mA mA V
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Suggestion Profile:
Suggestion IR Reflow Profile For Pb Free Process
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical
Optical
Characteristics
At Ta=25
Parameter
Symbol
Part No.
LTST-
Min.
Typ.
Max.
Unit
Test Condition
IF = 5mA Note 1 Note 2 (Fig.6) Measurement @Peak (Fig.1) IF = 5mA Note 1
Luminous Intensity
IV
S320ZBKT-5A
11.2
14.0
mcd
Viewing Angle
21/2
S320ZBKT-5A
130
deg
Peak Emission Wavelength
Peak d
S320ZBKT-5A
468
nm
Dominant Wavelength
S320ZBKT-5A
470.0
-
475.0
nm
Spectral Line Half-Width
S320ZBKT-5A
25
nm
Forward Voltage
VF
S320ZBKT-5A
-
3.1
V
IF = 5mA
Reverse Voltage
VFz
S320ZBKT-5A
0.60
1.20
V
IFz =10mA
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Bin Code List
Forward Voltage Bin Code B10 B11 12 13 Min. 2.70 2.80 2.90 3.00 Unit: V @5mA Max. 2.80 2.90 3.00 3.10
Tolerance on each Forward Voltage bin is +/-0.1 volt Luminous Intensity Bin Code L1 L2 M1 M2 N1 N2 Min. 11.2 14.0 18.0 22.4 28.0 35.5 Tolerance on each Intensity bin is +/-15% Dominant Wavelength Bin Code AD Min. 470.0 Unit : nm @5mA Max. 475.0 Unit : mcd @5mA Max. 14.0 18.0 22.4 28.0 35.5 45.0
Tolerance for each Dominate Wavelength bin is +/- 1nm
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical (25
Electrical Ambient
/
Optical
Characteristics
Curves
Temperature Unless
Otherwise Noted)
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. Suggest Soldering Pad Dimensions Suggest Soldering direction:
Package Dimensions Of Tape And Reel
Notes: 1. All dimensions are in millimeters (inches).
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-3000 pieces per reel. 3. Minimum packing quantity is 500 pcs for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon's Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The package is sealed: The LEDs should be stored at 30C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30C temperature or 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within one week. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C for at least 20 hours before solder assembly. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 4. Soldering Recommended soldering conditions: Reflow soldering
Pre-heat Pre-heat time Peak temperature Soldering time
Soldering iron
150~200C Temperature 300C Max. 120 sec. Max. Soldering time 3 sec. Max. 260C Max. (one time only) 10 sec. Max.(Max. two times)
Soldering notes: Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. Part No. : LTST-S320ZBKT-5A Page : 9 of 12
BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only 5. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 6. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED's plastic lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or " no lightup " at low currents. To verify for ESD damage, check for " lightup " and Vf of the suspect LEDs at low currents. The Vf of " good " LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or " no lightup " at low currents. To verify for ESD damage, check for " lightup " and Vf of the suspect LEDs at low currents. The Vf of " good " LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Classification Test Item
Operation Life High Temperature High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling
Test Condition
Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. IR-Reflow In-Board, 2 Times Ta= 655,RH= 9095% *Test Time= 240HRS2HRS Ta= 1055 *Test Time= 1000HRS (-24HRS,+72HRS) Ta= -555 *Test Time=1000HRS (-24HRS,+72H RS) 105 25 -55 25 30mins 5mins 30mins 5mins 10 Cycles IR-Reflow In-Board, 2 Times 85 5 -40 5 10mins 10mins 10 Cycles T.sol= 260 5 Dwell Time= 10 1secs Ramp-up rate(217 to Peak) +3/ second max Temp. maintain at 175(25) 180 seconds max Temp. maintain above 217 60-150 seconds Peak temperature range 260+0/-5 Time within 5C of actual Peak Temperature (tp) 10~30 seconds Ramp-down rate +6/second max T.sol= 235 5 Immersion time 20.5 sec Immersion rate 252.5 mm/sec Coverage 95% of the dipped surface
Reference Standard
MIL-STD-750D:1026 MIL-STD-883D:1005 JIS C 7021:B-1 MIL-STD-202F:103B JIS C 7021:B-11
Endurance Test
MIL-STD-883D:1008 JIS C 7021:B-10 JIS C 7021:B-12 ) MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 JIS C 7021:A-4 MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1011 MIL-STD-202F:210A MIL-STD-750D:2031 JIS C 7021:A-1
MIL-STD-750D:2031.2 J-STD-020D
Thermal Shock Solder Resistance
Environmental Test
IR-Reflow Pb Free Process
Solderability
MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC 68 Part 2-20 JIS C 7021:A-2
8. Others The appearance and specifications of the product may be modified for improvement without prior notice.
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only 9. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file?
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